The Evolution of Semiconductor Processes – What Do 7nm, 5nm, and 3nm Really Mean?
As smartphones and computers continue to evolve, we frequently hear terms like 7nm, 5nm, and 3nm when discussing chip performance. But what exactly do these numbers mean, and why does getting smaller matter so much? In this post, we break down the meaning of process node miniaturization, how it works, and why it's the key to modern chip innovation.
1. What Does 'nm' Stand For?
nm (nanometer) refers to one-billionth of a meter. In semiconductor terms, "7nm process" used to refer to the gate length of a transistor. Today, however, these labels are more marketing-driven and no longer directly reflect physical measurements.
Instead, 5nm and 3nm represent relative improvements in logic density, performance, and power efficiency.
2. Why Process Shrinking Matters
- Higher transistor density: More circuits fit into the same chip area
- Lower power consumption: Shorter distances mean less power loss
- Faster speeds: Faster switching with reduced heat output
Smaller nodes lead to better performance and energy efficiency — the core idea behind Moore’s Law.
3. Comparison Between Major Foundries
Each chipmaker defines its process nodes differently. For example, Samsung’s 5nm process and TSMC’s 5nm differ in density and efficiency, while Intel uses names like "Intel 7" and "Intel 4."
| Company | Process Name | Notes |
|---|---|---|
| TSMC | N7, N5, N3 | Used in iPhone, AMD processors |
| Samsung | 5LPE, 3GAP | First to adopt GAA technology |
| Intel | Intel 7, Intel 4 | Formerly known as 10nm |
Each company brands its process based on transistor density, power efficiency, and yield.
4. FinFET and GAA – Structural Advancements
FinFET uses a 3D structure where the gate wraps around three sides of the transistor channel, offering better electrical control. It has been standard since the 22nm node.
GAA (Gate-All-Around) improves on FinFET by surrounding the channel completely, offering even better leakage control and current management. Samsung was the first to introduce GAA at the 3nm node.
5. The Role of EUV in Advanced Nodes
Sub-10nm manufacturing requires more precise lithography. This is where EUV (Extreme Ultraviolet) technology, which uses a 13.5nm wavelength light source, comes in. EUV allows finer circuit etching but requires advanced equipment and introduces yield challenges.
ASML is currently the exclusive provider of EUV machines, used by TSMC, Samsung, and Intel.
6. Process vs. Architecture – Two Sides of Performance
While process nodes affect physical performance characteristics, actual performance also depends on CPU/GPU architecture design. Two chips made with the same node may have very different outcomes depending on their internal logic structure.
7. Conclusion – Shrinking Means Power
Process nodes aren't just about numbers — they're about power efficiency, speed, and thermal control. As we move toward 3nm, 2nm, and nanosheet technologies, the capabilities of modern chips will continue to expand. In semiconductor terms, smaller really is stronger.
